Intel Corp. INTC reportedly has finally put a figure on how much government aid it wants to build out its manufacturing capacity, at least in Europe. Intel Chief Executive Pat Gelsinger was quoted in various media reports as having told Politico Europe in an interview that the chip maker is looking for 8 billion euros, or $9.6 billion, in its push to build out silicon wafer capacity in Europe so chip makers become less reliant on third-party fabs like Taiwan Semiconductor Manufacturing Co. TSM “What we’re asking from both the U.S. and the European governments is to make it competitive for us to do it here compared to in Asia,” Gelsinger reportedly told Politico Europe. Globally, manufacturers are facing a shortage of semiconductors and the fabs that make the silicon wafers used for chips are running months-long waiting lists for customers. In the U.S., the Biden Administration has already earmarked about $50 billion in government aid for semiconductor manufacturing and research.
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